Description
The electronic industry is experiencing a remarkable evolution, rapidly advancing towards miniaturization, high integration, and high power. This transformative trend places increasingly stringent demands on the performance of electronic materials, as the need for enhanced functionality and reliability becomes paramount. In this dynamic landscape, silicon dioxide (also known as silica, white carbon black), has emerged as a game-changer. Boasting exceptional insulation, high temperature resistance, and superior heat dissipation properties, it has become an indispensable cornerstone in the production of semiconductors, printed circuit boards (PCBs), and LED packaging. Whether serving as an insulating filler, a crucial heat dissipation material, or an additive in packaging adhesives, silicon dioxide plays a pivotal role in ensuring the stable operation and extended service life of electronic components.
In the realm of semiconductor manufacturing, especially in the intricate world of integrated circuits (ICs), the insulation and purity of materials are not just important—they are the linchpin of success. The interlayer dielectric layer of ICs must exhibit unparalleled insulation performance to safeguard against signal interference between different layers, a challenge that becomes increasingly complex as device geometries shrink. Our electronic-grade fumed silica, with an astonishing purity of 99.99%, stands head and shoulders above the competition. Rigorously tested to eliminate almost all traces of impurities such as metal ions and organic matter, it offers a level of quality that is second to none.
When utilized as a raw material for the interlayer dielectric layer, our fumed silica undergoes a remarkable transformation through chemical vapor deposition (CVD) technology. This process results in the formation of a dense SiO₂ film with a dielectric constant as low as 3.5, a significant improvement over traditional silicon nitride, which has a dielectric constant of 7.5. This reduction in dielectric constant translates into a substantial decrease in signal delay, enabling a significant boost in the operating speed of the IC. The real-world impact of our product is best illustrated by the experience of a leading semiconductor manufacturer in Taiwan. When they incorporated our fumed silica into their 7nm process ICs, they witnessed a remarkable 20% increase in the IC’s operating frequency, coupled with a 15% reduction in power consumption. Additionally, the high temperature resistance of silica ensures that the dielectric layer can endure the intense heat of 400°C during the IC packaging process without succumbing to deformation or cracking, providing an added layer of reliability.
Printed circuit boards (PCBs) are the unsung heroes of the electronic world, serving as the core components that connect and support all other electronic devices. In high-power applications such as servers and automotive electronics, PCBs are subjected to extreme conditions, generating a significant amount of heat during operation. To address this challenge, white carbon black is employed to enhance the board’s insulation and heat resistance.
By adding high-purity precipitated white carbon black (with a SiO₂ content ≥99.9%) to the PCB substrate, typically an FR-4 epoxy resin substrate, the thermal conductivity of the substrate can be significantly improved. In practical terms, this means that the thermal conductivity can be increased from 0.3W/m·K to 0.8W/m·K, effectively accelerating heat dissipation and preventing overheating. Simultaneously, the insulation performance of silica ensures that the PCB has a high breakdown voltage. After the addition of white carbon black, the breakdown voltage of the PCB substrate can be elevated from 25kV/mm to 40kV/mm, substantially reducing the risk of short circuits caused by insulation failure. The efficacy of our product is demonstrated by the experience of a PCB manufacturer in China. When they integrated our white carbon black into their automotive PCB products, the boards not only met but exceeded the automotive industry’s strict temperature cycle test (-40°C to 125°C, 1000 cycles) without any discernible degradation in performance.
In the realm of LED packaging, white carbon black plays a dual role as a diffusing agent and heat dissipation filler. LED lamps rely on uniform light emission and efficient heat dissipation to maintain optimal luminous efficiency and extend their service life. By incorporating 5-10% of precipitated white carbon black with a precisely controlled particle size of 20-30nm into the LED packaging epoxy resin, the light emitted by the LED chip is evenly diffused, effectively eliminating the problem of “hot spots” and creating a more soft and comfortable lighting experience. Despite the addition of white carbon black, the light transmittance of the packaging resin remains above 90%, ensuring that the LED’s luminous efficiency remains unaffected.
Moreover, the silica significantly enhances the heat dissipation performance of the packaging resin. By forming a robust heat conduction network within the resin, it increases the thermal conductivity of the packaging material by 50%, effectively reducing the temperature of the LED chip during operation. A German LED lighting brand experienced firsthand the benefits of our white carbon black. When they integrated our product into their high-power LED downlights, they observed a remarkable extension in the downlights’ service life, from 30,000 hours to 50,000 hours. Additionally, the luminous flux attenuation rate was reduced from 20% to 8% after 10,000 hours of use, showcasing the superior performance and durability of our product.
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